Technologically relevant experimental techniques for the study of the mechanical behavior of engineering materials in bulk and thin film form, including tension testing, nanoindentation, and wafer curvature stress analysis. Metallic and polymeric systems. In addition to regularly scheduled lecture (M/W), this course includes a three-hour lab session every other week (T/W/Th). Lab sections will be assigned after first class meeting. Undergraduates register for 163 in 4 units; graduates register in 173 for 3 units.