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IME 627 - Packaging for Electronics

Description
Processes and materials for packaging of electronic components and devices, including integrated circuit chips, chip packages, and board level packaged systems; boards and substrates technology; quality and reliability of electronic packages. Open to all engineering majors. S/2 (odd years). Cross-listed with ECE 627. {Also offered for undergraduate credit - see IME 427.}. Class Notes: lab time to be determined.
Credits
3
Recent Professors
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Recent Semesters
Fall 2018, Fall 2017
Offered
TuTh
Avg. Class Size
5
Avg. Sections
1